Becker Transactions Announces Exclusive Sale of Next-Generation LED Packaging Patent Portfolio

STARKVILLE, MS, UNITED STATES, March 11, 2026 /EINPresswire.com/ -- Becker Transactions today announced the exclusive ...
Semiconductor Engineering

Singulated Die Test Ensures Stacked Die Quality As Power Density Rises

The high power density in turn produces large thermal gradients, with the low to max temperature changes increasing ...
IEEE

High-Temperature Pb–Sn–Ag Solder Die Attach in PQFN Power Packages: Performance Benchmarks for Pb-Free Transition

Abstract: Power Quad Flat No-Lead (PQFN) packages utilizing high-lead (High-Pb) Pb–Sn–Ag solders remain prevalent in automotive power semiconductors despite impending regulatory restrictions. With EU ...
IEEE

Evaluating High Temperature Die Attachment Materials: Reliability and Fatigue Performance Beyond 175°C

Abstract: The development of high-temperature power modules is a critical aspect to enhancing the performance and reliability of modern electronics, especially in automotive and aerospace industries.