Competition in the AI semiconductor market is expanding beyond high bandwidth memory (HBM) to server low-power dynamic random-access memory (DRAM) modules known as Socamm2.

Micron is preparing to report fiscal second-quarter results on March 18, and analysts at GF Securities expect the company to reaffirm tha ...

Companies to work together at Applied’s EPIC Center in Silicon Valley to accelerate development of advanced DRAM, high-bandwidth memory and NAND ...

But it'll be phones and tablets that will get it first.

Explosive growth in AI workloads is forcing the storage industry to pack more data onto disks to meet demand from cloud giants Memory price hikes are likely to become "the new normal" for the next few ...

Joint R&D programs focused on advancing materials engineering and advanced packaging innovations for next-generation DRAM and high-bandwidth ...

Applied Materials partners with SK hynix to develop next-gen DRAM and high-bandwidth memory for AI, tackling the memory-speed gap—read the update now.

It could boil down to picking your favorite AI bottleneck with these two stocks.

Micron Technology (NasdaqGS:MU) and Applied Materials announced a new collaboration to accelerate next generation memory for AI workloads in the US. The partnership centers on co developing DRAM, HBM, ...

Hewlett Packard Enterprise (HPE) reported a strong fiscal first quarter with surging AI orders that outpaced revenue, while ...

Apple quietly updated Mac Studio configuration options this week, removing the 512GB memory upgrade. As of yesterday, there ...

Applied Materials and SK hynix are partnering to accelerate the development and deployment of advanced memory technology to meet the growing needs of AI and high-performance computing.