Trojan Detection in COTS Hardware via Statistical Activation of Microarchitectural Events” was published by researchers at ...
How atomic-layer deposition and hybrid dielectrics are redefining reliability and scaling for AI-era semiconductors.
Recently, that number has risen to five, and while it adds far more flexibility for structuring electronic equipment, it also ...
Amorphous oxide semiconductors like IGZO (indium gallium zinc oxide) offer acceptable carrier mobility with very low leakage.
Memory Re-orderings as a Timerless Side-channel” was published by researchers at University of Washington, Duke University, ...
A new technical paper titled “The Quest for Reliable AI Accelerators: Cross-Layer Evaluation and Design Optimization” was ...
Semiconductor Engineering tracked 12 rounds of $100 million or more in Q4 and 11 in Q3, a significant increase from earlier ...
Over 40% of semiconductor facilities announced since 2021 are located in watersheds projected to face high water stress between 2030 and 2040.
AI/ML are driving a steep ramp in neural processing unit (NPU) design activity for everything from data centers to edge ...
Beyond cold plates lies what’s sometimes called direct impingement, or direct liquid cooling (DLC), meaning that coolant ...
ALD for Ru wiring; vertical nanolasers; hydrogel semiconductors.
AI squeezes consumer memory market; 3D-IC basics, challenges; atomistic simulation; GPUs and auto security; AI-assisted training.
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