The continuous development of grinding is towards an increased material removal rate (MRR) and at the same time towards an improved surface finish 1. Lapping with the use of loose abrasives is one of ...
The lapping process involves thinning wafers from the back with a rotating abrasive surface. It is important to receive precise feedback as the process is carried out to monitor the quantity of ...
SAN JOSE, Calif., Feb. 23, 2011 /PRNewswire/ -- Novellus Systems announced today that its subsidiary Peter Wolters GmbH has introduced a new version of its microLine double side lapping system for ...
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