Together with partners, the SCHMID Advanced Integrated Circuit (IC) Packaging Lab Solution is currently the sole supplier for full TGV lab with all process steps necessary to turn a bare glass ...

MILPITAS, Calif., Sept. 21, 2020 /PRNewswire/ -- Today, KLA Corporation (NASDAQ: KLAC) announced the launch of the Kronos™ 1190 wafer-level packaging inspection system, the ICOS™ F160XP die sorting ...

Dr. Navid Asadi’s group examines chip packaging methods such as system-in-package (SIP). This is the second of a mutlipart series on chip packaging technologies. Peter (Chengjie) Xi is currently a ...

Navid Asadi is an assistant professor in the department of electrical and computer engineering at university of Florida. His research is mainly focused on physical inspection of electronics from ...

You may have heard the phrase “flip-chip” before: it’s a broad term referring to several integrated circuit packaging methods, the common thread being that the semiconductor die is flipped upside down ...

Flexible circuit design is fast becoming a preferred electronic circuit packaging practice that is used to create such products as mobile flip-phones or laptop computers. With marketing teams striving ...