Artificial intelligence (AI) and high-performance computing are driving unprecedented demand for advanced semiconductor ...

Advanced chip packaging, which boosts computing power for artificial intelligence, has made the United States more reliant on ...

TEMPE, Ariz.--(BUSINESS WIRE)-- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, today announces ...

Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chipsA new epitaxy system optimized for DRAM ...

Taiwan Semiconductor Manufacturing Company recently announced a 10-year agreement with Amkor Technology to expand advanced semiconductor packaging and testing capacity in Arizona, supporting a more ...

Partnership unites UWBG semiconductor & advanced packaging materials for HVDC grid technology to unlock massive power ...

Chinese chip-packaging and testing giant Jiangsu Changjiang Electronics Technology (JCET) says it will invest 7.8 billion ...

Aug 1 (Reuters) - Taiwanese chipmaker TSMC 2330.TW has developed the most expansive arsenal of patents surrounding advanced chip packaging, followed by Samsung Electronics 005930.KS and then Intel ...

The U.S. Department of Commerce today announced the launch of a new federal funding competition that aims to spur the research and development of more advanced computer chip packaging technologies.

Taiwan Semiconductor Manufacturing Company (NYSE: TSM) and Amkor Technology, Inc. (Nasdaq: AMKR) today announced a 10-year agreement to foster a strong ...

TAICHUNG, Taiwan (Reuters) - Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it needs is changing, the U.S. AI chip giant's CEO Jensen Huang said on ...

GlobalFoundries (Nasdaq: GFS) (GF) today announced the production readiness of its SLATE™ wafer-to-wafer bonding technology on its industry-leading 9SW radio-frequency silicon-on-insulator (RF-SOI) ...