Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chipsA new epitaxy system optimized for DRAM ...

Q: Are chiplets simply an evolution of multi-chip modules (MCMs) from the 1990’s? A: In many ways, yes. Early multi-chip ...

Chipmaking equipment giant Applied Materials Inc. is trying to make life easier for its chip fabrication plant customers, so ...

There are new CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield chip ...

A test system checks chiplets before packaging, helping chip makers find faulty chips early, improve yield, and increase ...

Sixteen miles north of Albuquerque, in Rio Rancho, New Mexico, an Intel chip plant sits on more than 200 acres of land. The site was established in the 1980s, part of it built on top of a sod farm. In ...

In recent years, the issue of trustworthiness in electronics has become increasingly important, especially in areas where security is of the essence such as the automotive sector, industry, and ...

Growing momentum for advanced packaging is shifting design from a die-centric focus toward integrated systems with multiple die, but it’s also straining some EDA tools and methodologies and creating ...

(MENAFN- GetNews) Smart Weigh Packaging Machinery Co., Ltd., a global manufacturer of high-precision weighing and integrated packaging systems, has announced its participation in Interpack 2026, one ...

Intel Corp. INTC has appointed former SK Hynix and SK On chief executive Seok-Hee Lee as executive vice president of its ...

Intel has appointed former SK hynix and SK On CEO Lee Seok-hee as a senior vice president in its foundry business. Lee will ...