Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chipsA new epitaxy system optimized for DRAM ...

There are new CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield chip ...

Chipmaking equipment giant Applied Materials Inc. is trying to make life easier for its chip fabrication plant customers, so ...

Applied Materials (AMAT) held a master class event this week, and much of the focus was on the company's positioning in ...

Sixteen miles north of Albuquerque, in Rio Rancho, New Mexico, an Intel chip plant sits on more than 200 acres of land. The site was established in the 1980s, part of it built on top of a sod farm. In ...

SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...

In recent years, the issue of trustworthiness in electronics has become increasingly important, especially in areas where security is of the essence such as the automotive sector, industry, and ...

Intel has appointed former SK hynix and SK On CEO Lee Seok-hee as a senior vice president in its foundry business. Lee will ...

(MENAFN- GetNews) Smart Weigh Packaging Machinery Co., Ltd., a global manufacturer of high-precision weighing and integrated packaging systems, has announced its participation in Interpack 2026, one ...

Growing momentum for advanced packaging is shifting design from a die-centric focus toward integrated systems with multiple die, but it’s also straining some EDA tools and methodologies and creating ...

Intel Corp. INTC has appointed former SK Hynix and SK On chief executive Seok-Hee Lee as executive vice president of its ...

Advanced 5-Axis Waterjet System Increases Manufacturing Capacity, Design Opportunities, and Packaging Solutions for Aerospace, Medical, and Robotics ...